Difficult storm of microscopic heights: as chiplety leave in the third measurement / Analytics

On February 22, 2023 V to a pursuit of accumulation of power engineers continue to improve not simply technologies productions chips, and literally to transfer them to new measurements. From integral chips — to compound, from two-dimensional compound — to three-dimensional. What difficulties meet on this way — and what waits for us further? ⇣ Soderzhaniye Upershis in reticle limit, engineers-microelectronics engineers groped a logical exit — passed from integral SBiS to compound. But placement chipletov in the uniform plane complicates adjustment between them high-speed communications with small delays. And therefore following...